Power chips are attached to external circuits via packaging, and their performance depends upon the support of the product packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation refers to the electrical connection on the upper surface of the chip, which is generally light weight aluminum bonding cord in standard modules. ^
Typical power component plan cross-section
Presently, commercial silicon carbide power components still primarily make use of the product packaging modern technology of this wire-bonded typical silicon IGBT module. They encounter troubles such as large high-frequency parasitic parameters, insufficient warm dissipation capability, low-temperature resistance, and not enough insulation strength, which restrict making use of silicon carbide semiconductors. The screen of outstanding efficiency. In order to fix these problems and fully manipulate the huge possible benefits of silicon carbide chips, lots of brand-new product packaging innovations and services for silicon carbide power modules have arised in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold cables to copper wires, and the driving pressure is price reduction; high-power devices have developed from aluminum wires (strips) to Cu Clips, and the driving force is to boost product efficiency. The higher the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a solid copper bridge soldered to solder to link chips and pins. Compared to standard bonding product packaging approaches, Cu Clip technology has the following benefits:
1. The connection between the chip and the pins is made from copper sheets, which, to a certain extent, changes the typical cord bonding approach between the chip and the pins. Consequently, an one-of-a-kind package resistance worth, higher present flow, and far better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can totally conserve the price of silver plating and poor silver plating.
3. The item look is completely consistent with normal items and is mostly utilized in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more pricey and complicated, yet it can attain much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus cable bonding approach
The source pad makes use of a Clip approach, and the Gate utilizes a Cord method. This bonding method is a little less costly than the all-copper bonding method, saving wafer location (appropriate to very tiny gateway locations). The process is less complex than the all-copper bonding approach and can get much better Rdson and far better thermal result.
Distributor of Copper Strip
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